Hot melt adhesive

CAS NO. 25587-80-8    

Molecular formula:(C11H23NO2)x

Performance and application

It is made by high temperature reaction of dimeric acid and polyamine.Soluble in general organic solvents, its heating melting viscosity and heating temperature has a great relationship. It has the characteristics of low viscosity, good flow performance, good toughness and high bond strength.

Performance Characteristics

  1.  It has good low temperature solubility and soluble fusibility
  2.  It has high thermal stability.
  3.  It has strong flexibility.

Usage

  1. Hot melt adhesive for electronic and electrical shrinkable materials.
  2. shoe material, clothing, leather and other hot glue.
  3. hot melt adhesive, etc

Specifications

Hot melt adhesive

TypeColor(Fe-Co)Viscosity(Mpa.s/25℃)Acid value(mgKOH/g)Amine value(mgKOH/g)Softening point ℃Packing
CXD-01≤7#150-250≤6≤5110±525kg two-in-one paper-plastic bag
CXD-02≤7#250-350≤6≤5120±5

Packaging and storage

Two-in-one paper-plastic packaging bag, 25KG/ bag.